has reorganized its technology leadership. The company is apparently responding to the ongoing problems when switching to new manufacturing technologies that enable smaller processor structures. Among others, Murthy Renduchintala, Chief Engineering Officer and President of the Technology, Systems Architecture and Client Group (TSCG), is leaving the company.
As part of the reorganization, the TSCG will be divided into several individual areas, while the item Renduchintala will be deleted without replacement. Instead, the heads of the individual areas will report directly to Intel CEO Bob Swan in the future.
Technology Development is taken over by long-time Intel employee Ann Kelleher. It should focus on the development of the 7 and 5 nanometer processes. Her predecessor Mike Mayberry will retire at the end of the year, according to Intel. Until then, he is available as a consultant.
Keyvan Esfarjani is responsible for the Manufacturing and Operations area. The manager last oversees the production of the Non-Volatile Memory Solutions Group. As head of global production, he should also take care of building up new production capacities.
Another change has occurred for the Design Engineering division. She should also get a new boss – but Intel is still looking for a leading applicant worldwide for the position. Until then, Josh Walden, most recently head of the Product Assurance and Security Group, will oversee the Design Engineering division.
Raja Koduri and Rhandir Thakur remain at the top of the Architecture, Software and Graphics and Supply Chain divisions. The latter is promoted to Chief Supply Chain Officer and reports directly to CEO Bob Swan.
“I look forward to working directly with these talented and experienced technology leaders, each of whom is committed to advancing Intel in this critical phase of execution,” said Swan. “I would also like to thank Murthy for his leadership in helping Intel transform our technology platform.”
When it released its latest balance sheet last week, Intel announced that the launch of the first 7-nanometer processors would be delayed by six months. The production yield in this area is said to be even twelve months behind the planned target. Analysts fear that the debacle could repeat itself when switching to 10-nanometer processes and that Intel loses connection to AMD and TSMC at least in terms of production processes.
AMD also announced last week the first desktop CPUs with integrated graphics for consumers and companies that are manufactured in a 7-nanometer process. TSMC has also already taken the step to small structures of 7 nanometers and is about to produce 5 nanometer chips.
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